Metal foil RF micro-relay with integrated heat sink for high power applications

F. M. Ozkeskin, S. Choi, K. Sarabandi, Y. B. Gianchandani

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

This paper reports an electrostatically actuated ohmic contact micro-relay for high power RF applications. Stainless steel cantilevered micro-relays with platinum-rhodium contacts are micromachined from bulk foils and assembled on the printed circuit boards. Micromachined aluminum heat sinks are integrated on the cantilevers above the point of contact. The devices have a footprint of 2×3.2 mm2. Fabricated relays with 90 V turn-on voltage accommodate 10 W of incident RF power at 1 GHz with -0.25 dB of down-state insertion loss and -37 dB of up-state isolation.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages776-779
Number of pages4
DOIs
StatePublished - 2011
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 23 Jan 201127 Jan 2011

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country/TerritoryMexico
CityCancun
Period23/01/1127/01/11

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