@inproceedings{f2ce02425f30473685c18c6843113dee,
title = "Modeling and analysis of die-to-die vertical coupling in 3-D IC",
abstract = "In this paper, die-to-die vertical coupling between clock tree and spiral inductor in three-dimension (3-D) IC is analyzed, and equivalent circuit model for analysis of vertical coupling mechanism is proposed. Analysis and modeling are verified by measurement results of a designed and fabricated test vehicle. The test vehicle has two stacked dies with clock tree or a spiral inductor.",
keywords = "3-D IC, Coupling, Die to die, Die-to-die, Modeling, S-parameter, SiP, Spiral inductor, Stacking, Through-silicon-via (TSV), Vertical, Wire bonding",
author = "Sangrok Lee and Gawon Kim and Jaemin Kim and Taigon Song and Junho Lee and Hyungdong Lee and Kunwoo Park and Joungho Kim",
year = "2009",
doi = "10.1109/EPTC.2009.5416459",
language = "English",
isbn = "9781424451005",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
pages = "707--711",
booktitle = "EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference",
note = "2009 11th Electronic Packaging Technology Conference, EPTC 2009 ; Conference date: 09-12-2009 Through 11-12-2009",
}