Modeling and analyzing of electrowetting using electromagnetic body force density and surface tension

Tan Il Sung, Hong Soon Choi, Young Sun Kim, Il Han Park

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The understanding of electrowetting phenomenon is an essential way for controlling tiny droplets on dielectric material surfaces. In conventional viewpoint, the shape of droplet is determined by the contact angle which is influenced by applied electric field. In this paper, we present a new approach to modeling and analyzing the electrowetting phenomenon. It is based on electromagnetic body force and surface tension as well as the initial contact angle. The pressures on the surface of droplet are calculated by using the revised Kelvin's formula, the hydrostatic equation and the surface tension due to surface curvature. The electrowetting phenomenon was successfully modeled and analyzed using the proposed approach.

Original languageEnglish
Title of host publicationDigests of the 2010 14th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC 2010
DOIs
StatePublished - 2010
Event14th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC2010 - Chicago, IL, United States
Duration: 9 May 201012 May 2010

Publication series

NameDigests of the 2010 14th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC 2010

Conference

Conference14th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC2010
Country/TerritoryUnited States
CityChicago, IL
Period9/05/1012/05/10

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