Modular approach in sensor board design

Jeonghoon Kang, Jaechul Kim, Du Hwan Yeo, Jongmin Hyun, Kooklae Jo, Taejoon Choi, Pil Mhan Jung, Hangyeol Kim, Su Chang Lee, Sukun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Designing a new sensor board is costly, especially for a production in a small quantity. By modularizing common functionalities, a large portion of the sensor board can be reused. In this work, we propose an Extension Board, a sensor board which is modularized into 3 parts. Power module, and MCU and RF module are shared, and only sensing module is redesigned for each sensor board. Diverse sensing modules are produced. The process was simple and inexpensive.

Original languageEnglish
Title of host publicationSenSys 2012 - Proceedings of the 10th ACM Conference on Embedded Networked Sensor Systems
Pages365-366
Number of pages2
DOIs
StatePublished - 2012
Event10th ACM Conference on Embedded Networked Sensor Systems, SenSys 2012 - Toronto, ON, Canada
Duration: 6 Nov 20129 Nov 2012

Publication series

NameSenSys 2012 - Proceedings of the 10th ACM Conference on Embedded Networked Sensor Systems

Conference

Conference10th ACM Conference on Embedded Networked Sensor Systems, SenSys 2012
Country/TerritoryCanada
CityToronto, ON
Period6/11/129/11/12

Keywords

  • Modularization
  • Wireless sensor networks

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