TY - GEN
T1 - Modular approach in sensor board design
AU - Kang, Jeonghoon
AU - Kim, Jaechul
AU - Yeo, Du Hwan
AU - Hyun, Jongmin
AU - Jo, Kooklae
AU - Choi, Taejoon
AU - Jung, Pil Mhan
AU - Kim, Hangyeol
AU - Lee, Su Chang
AU - Kim, Sukun
PY - 2012
Y1 - 2012
N2 - Designing a new sensor board is costly, especially for a production in a small quantity. By modularizing common functionalities, a large portion of the sensor board can be reused. In this work, we propose an Extension Board, a sensor board which is modularized into 3 parts. Power module, and MCU and RF module are shared, and only sensing module is redesigned for each sensor board. Diverse sensing modules are produced. The process was simple and inexpensive.
AB - Designing a new sensor board is costly, especially for a production in a small quantity. By modularizing common functionalities, a large portion of the sensor board can be reused. In this work, we propose an Extension Board, a sensor board which is modularized into 3 parts. Power module, and MCU and RF module are shared, and only sensing module is redesigned for each sensor board. Diverse sensing modules are produced. The process was simple and inexpensive.
KW - Modularization
KW - Wireless sensor networks
UR - http://www.scopus.com/inward/record.url?scp=84873476331&partnerID=8YFLogxK
U2 - 10.1145/2426656.2426711
DO - 10.1145/2426656.2426711
M3 - Conference contribution
AN - SCOPUS:84873476331
SN - 9781450311694
T3 - SenSys 2012 - Proceedings of the 10th ACM Conference on Embedded Networked Sensor Systems
SP - 365
EP - 366
BT - SenSys 2012 - Proceedings of the 10th ACM Conference on Embedded Networked Sensor Systems
T2 - 10th ACM Conference on Embedded Networked Sensor Systems, SenSys 2012
Y2 - 6 November 2012 through 9 November 2012
ER -