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Multi-state resistance switching and variability analysis of HfOx based RRAM for ultra-high density memory applications

  • Amit Prakash
  • , J. S. Park
  • , J. Song
  • , S. J. Lim
  • , J. H. Park
  • , J. Woo
  • , E. Cha
  • , Hyunsang Hwang
  • Pohang University of Science and Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

14 Scopus citations

Abstract

In this study, we have investigated the multi-level cell (MLC) characteristics and variability analysis of multiple resistance states of one of the most promising and extensively studied binary oxide (HfOx) based nanometer scale RRAM stack by varying the switching current. The device size and thickness of stack layers were confirmed by transmission electron microscope (TEM) images. In the CMOS friendly stack with TiN/Ti/HfOx/TiN structure, 3 distinct levels of low resistance states (LRS) with same high resistance state (HRS) were successfully obtained which can be used in 2-bit per cell storage. It was found that the switching variability was the strong function of the number of defects in the filament or the switching current (IC) and it significantly improved at higher IC. All the resistance levels show good inter switching ability and reliability characteristics such as read disturb immunity, read pulse endurance (>108 times) and data retention.

Original languageEnglish
Title of host publication4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479942084
DOIs
StatePublished - 23 Jun 2015
Event4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015 - Taipei, Taiwan, Province of China
Duration: 4 May 20156 May 2015

Publication series

Name4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015

Conference

Conference4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015
Country/TerritoryTaiwan, Province of China
CityTaipei
Period4/05/156/05/15

Keywords

  • HfO
  • high density storage
  • Multi-level cell
  • RRAM
  • switching variability

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