TY - GEN
T1 - Nano-size structure formation on Si substrate for optical device application
AU - Kong, Daeyoung
AU - Oh, Junghwa
AU - Kim, Bonghwan
AU - Cho, Chanseob
AU - Lee, Jonghyun
PY - 2012
Y1 - 2012
N2 - We have found optimized RIE conditions by increasing the distance between the metal mesh and silicon wafer. We have also found that by increasing the reactive ion etching (RIE) process time with an optimized SF6/O 2 ratio, pressure, and RF power. It is possible to switch from a random texture to an nm-size pyramid texture on μm-size pyramid texture. This RIE system textured a crystalline wafer surface that formed approximately 10∼20 nm structures on 2∼3 μm pyramidal silicon with less than 3% of reflectivity.
AB - We have found optimized RIE conditions by increasing the distance between the metal mesh and silicon wafer. We have also found that by increasing the reactive ion etching (RIE) process time with an optimized SF6/O 2 ratio, pressure, and RF power. It is possible to switch from a random texture to an nm-size pyramid texture on μm-size pyramid texture. This RIE system textured a crystalline wafer surface that formed approximately 10∼20 nm structures on 2∼3 μm pyramidal silicon with less than 3% of reflectivity.
UR - https://www.scopus.com/pages/publications/84873960428
U2 - 10.1109/ICSENS.2012.6411291
DO - 10.1109/ICSENS.2012.6411291
M3 - Conference contribution
AN - SCOPUS:84873960428
SN - 9781457717659
T3 - Proceedings of IEEE Sensors
BT - IEEE SENSORS 2012 - Proceedings
T2 - 11th IEEE SENSORS 2012 Conference
Y2 - 28 October 2012 through 31 October 2012
ER -