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Nano-size structure formation on Si substrate for optical device application

  • Daeyoung Kong
  • , Junghwa Oh
  • , Bonghwan Kim
  • , Chanseob Cho
  • , Jonghyun Lee
  • Kyungpook National University
  • Catholic University of Daegu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

We have found optimized RIE conditions by increasing the distance between the metal mesh and silicon wafer. We have also found that by increasing the reactive ion etching (RIE) process time with an optimized SF6/O 2 ratio, pressure, and RF power. It is possible to switch from a random texture to an nm-size pyramid texture on μm-size pyramid texture. This RIE system textured a crystalline wafer surface that formed approximately 10∼20 nm structures on 2∼3 μm pyramidal silicon with less than 3% of reflectivity.

Original languageEnglish
Title of host publicationIEEE SENSORS 2012 - Proceedings
DOIs
StatePublished - 2012
Event11th IEEE SENSORS 2012 Conference - Taipei, Taiwan, Province of China
Duration: 28 Oct 201231 Oct 2012

Publication series

NameProceedings of IEEE Sensors

Conference

Conference11th IEEE SENSORS 2012 Conference
Country/TerritoryTaiwan, Province of China
CityTaipei
Period28/10/1231/10/12

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