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New ICA based thermal error compensation system

  • Seoul National University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Thermal error of machine tools is one of the most significant considerations on machining errors. One of the difficult issues in thermal error compensation system is to select appropriate temperature variables and to obtain accurate thermal error model. In this paper, a new thermal error compensation method is proposed based on the independent component analysis (ICA). The proposed method extracts independent thermal error sources, namely virtual heat sources, using observed temperatures. A new thermal error modeling method using several significant sources among the extracted sources is also presented. The model has three submodels according to its operating condition. The proposed algorithm is tested using a used machining center. For the case of our machine tool, only one heat source is sufficient to model the thermal errors. The proposed model reduces the thermal errors to few microns and it corresponds to 1/10 of the original error.

Original languageEnglish
Title of host publicationICONIP 2002 - Proceedings of the 9th International Conference on Neural Information Processing
Subtitle of host publicationComputational Intelligence for the E-Age
EditorsJagath C. Rajapakse, Soo-Young Lee, Lipo Wang, Kunihiko Fukushima, Xin Yao
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1378-1382
Number of pages5
ISBN (Electronic)9810475241, 9789810475246
DOIs
StatePublished - 2002
Event9th International Conference on Neural Information Processing, ICONIP 2002 - Singapore, Singapore
Duration: 18 Nov 200222 Nov 2002

Publication series

NameICONIP 2002 - Proceedings of the 9th International Conference on Neural Information Processing: Computational Intelligence for the E-Age
Volume3

Conference

Conference9th International Conference on Neural Information Processing, ICONIP 2002
Country/TerritorySingapore
CitySingapore
Period18/11/0222/11/02

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