Abstract
A normally off GaN MOSFET was proposed by utilizing an extremely high 2-D electron-gas density >1014/cm2) at an AlGaN/GaN heterostructure as source and drain, which can be obtained by controlling the tensile stress accompanied with the growth of GaN on silicon substrate. The fabricated MOSFET with an Al2O3 gate insulator exhibited excellent device performance, such as a threshold voltage of 2 V, drain current of 353 mA/mm, extrinsic transconductance of 98 mS/mm, and field-effect mobility of 225 cm2/V s.
Original language | English |
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Article number | 5404411 |
Pages (from-to) | 192-194 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 31 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2010 |
Keywords
- 2-D electron gas (2DEG)
- GaN
- MOSFETs
- Normally off
- Silicon substrate