Numerical Analysis of Breakdown Phenomena for Polymeric Insulators After Thermal Aging Process

Minhee Kim, Su Hun Kim, Hyeong Jun Kim, Se Hee Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

We numerically analyzed the changes in breakdown strength after the thermal aged low-density polyethylene employing quantum chemical calculations. The newly generated impurity in the molecular chain produced the new energy states by the thermal aging process. The quantum chemical calculation contributed to analyzing these microscopic changes in energy state. In particular, the increases of deep traps greatly affected the space charge dynamics and breakdown strength. Finally, we numerically analyzed the changes in the deep trap that played an important role in changing the breakdown strength by employing the finite element method.

Original languageEnglish
Title of host publicationICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages773-776
Number of pages4
ISBN (Electronic)9781665418331
DOIs
StatePublished - 2022
Event4th IEEE International Conference on Dielectrics, ICD 2022 - Palermo, Italy
Duration: 3 Jul 20227 Jul 2022

Publication series

NameICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings

Conference

Conference4th IEEE International Conference on Dielectrics, ICD 2022
Country/TerritoryItaly
CityPalermo
Period3/07/227/07/22

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