Numerical study on the optimum heat transfer design for improvement of mura phenomenon in the side lighting LED BLU

Hyun Ki Kim, Jong Hui Lee, Il Seouk Park

Research output: Contribution to journalArticlepeer-review

Abstract

This study aims to improve sheet wrinkles and mura due to the internal heat of light-emitting diode (LED) package (PKG), which is used as a light source of a side-lighting LED (back light unit) BLU. In order to solve the local heating problem, the variations of the conduction heat-transfer characteristics inside the LED BLU with the thickness, length, and thermal conductivity of the metal chassis are numerically investigated, and optimum heat dissipation design conditions are derived. As the thickness and length of the metal chassis increased, the total area of the heat sink decreased, and the overall temperature decreased as the thermal conductivity increased. Based on the results of this study, the correlation equation relating the thickness, length, and thermal conductivity of the metal chassis for the proper management of temperature, which is the main cause of sheet wrinkles and the mura phenomena, is derived.

Original languageEnglish
Pages (from-to)761-767
Number of pages7
JournalTransactions of the Korean Society of Mechanical Engineers, B
Volume42
Issue number11
DOIs
StatePublished - Nov 2018

Keywords

  • BLU(Back Light Unit)
  • Conduction Heat Transfer
  • LED(Light Emitting Diode)
  • Wrinkle

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