On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs

Yarui Peng; Taigon Song; Dusan Petranovic; Sung Kyu Lim

doi:10.1109/ICCAD.2013.6691133

On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs

Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim

School of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

18 Scopus citations

Abstract

In this paper, we present a multiple-TSV based TSV-to-TSV coupling model and extraction methods that consider the impact of depletion region, the silicon substrate effect, and the electrical field distribution around TSVs. Our studies show that these factors have a significant impact on the individual and full-chip scale TSV-to-TSV coupling. Our effort leads to a simplified coupling model that is accurate and efficient on timing, power, and signal integrity in full-chip scale. In order to alleviate the coupling noise in full-chip level 3DIC, we propose grounded guard rings that are more effective than grounded TSV insertion. Results show that our approach reduces coupling noise on TSV nets up to 27.3% with only 7.65% area overhead.

Original language	English
Title of host publication	2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers
Pages	281-288
Number of pages	8
DOIs	https://doi.org/10.1109/ICCAD.2013.6691133
State	Published - 2013
Event	2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - San Jose, CA, United States Duration: 18 Nov 2013 → 21 Nov 2013

Publication series

Name	IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)	1092-3152

Conference

Conference	2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013
Country/Territory	United States
City	San Jose, CA
Period	18/11/13 → 21/11/13

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10.1109/ICCAD.2013.6691133

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Peng, Y., Song, T., Petranovic, D., & Lim, S. K. (2013). On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. In 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers (pp. 281-288). Article 6691133 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). https://doi.org/10.1109/ICCAD.2013.6691133

Peng, Yarui ; Song, Taigon ; Petranovic, Dusan et al. / On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers. 2013. pp. 281-288 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

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title = "On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs",

abstract = "In this paper, we present a multiple-TSV based TSV-to-TSV coupling model and extraction methods that consider the impact of depletion region, the silicon substrate effect, and the electrical field distribution around TSVs. Our studies show that these factors have a significant impact on the individual and full-chip scale TSV-to-TSV coupling. Our effort leads to a simplified coupling model that is accurate and efficient on timing, power, and signal integrity in full-chip scale. In order to alleviate the coupling noise in full-chip level 3DIC, we propose grounded guard rings that are more effective than grounded TSV insertion. Results show that our approach reduces coupling noise on TSV nets up to 27.3% with only 7.65% area overhead.",

author = "Yarui Peng and Taigon Song and Dusan Petranovic and Lim, {Sung Kyu}",

year = "2013",

doi = "10.1109/ICCAD.2013.6691133",

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series = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",

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booktitle = "2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers",

note = "2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 ; Conference date: 18-11-2013 Through 21-11-2013",

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Peng, Y, Song, T, Petranovic, D & Lim, SK 2013, On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. in 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers., 6691133, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, pp. 281-288, 2013 32nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013, San Jose, CA, United States, 18/11/13. https://doi.org/10.1109/ICCAD.2013.6691133

On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. / Peng, Yarui; Song, Taigon; Petranovic, Dusan et al.
2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers. 2013. p. 281-288 6691133 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - In this paper, we present a multiple-TSV based TSV-to-TSV coupling model and extraction methods that consider the impact of depletion region, the silicon substrate effect, and the electrical field distribution around TSVs. Our studies show that these factors have a significant impact on the individual and full-chip scale TSV-to-TSV coupling. Our effort leads to a simplified coupling model that is accurate and efficient on timing, power, and signal integrity in full-chip scale. In order to alleviate the coupling noise in full-chip level 3DIC, we propose grounded guard rings that are more effective than grounded TSV insertion. Results show that our approach reduces coupling noise on TSV nets up to 27.3% with only 7.65% area overhead.

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Peng Y, Song T, Petranovic D, Lim SK. On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. In 2013 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2013 - Digest of Technical Papers. 2013. p. 281-288. 6691133. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). doi: 10.1109/ICCAD.2013.6691133

On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs

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