@inproceedings{3233b0e41b9b4befa1f1649e5f1ba9c6,
title = "On enhancing power benefits in 3D ics: Block folding and bonding styles perspective",
abstract = "Low power is widely considered as a key benefit of 3D ICs, yet there have been few thorough design studies on how to maximize power benefits in 3D ICs. In this paper, we present design method- ologies to reduce power consumption in 3D ICs using a large-scale commercial-grade microprocessor (OpenSPARC T2). To further improve power benefits in 3D ICs on top of the traditional 3D floor- planning, we study the impact of block folding and bonding styles. We also develop an effective method to place face-to-face vias for our 2-tier 3D design for power optimization. With aforementioned methods combined, our 3D designs provide up to 20.3% power re- duction over the 2D counterpart under the same performance.",
keywords = "3D IC, Block folding, Bonding style, Power benefit",
author = "Moongon Jung and Taigon Song and Yang Wan and Yarui Peng and Lim, {Sung Kyu}",
year = "2014",
doi = "10.1145/2593069.2593167",
language = "English",
isbn = "9781479930173",
series = "Proceedings - Design Automation Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "DAC 2014 - 51st Design Automation Conference, Conference Proceedings",
address = "United States",
note = "51st Annual Design Automation Conference, DAC 2014 ; Conference date: 02-06-2014 Through 05-06-2014",
}