Organic Device Fabrication and Integration with CVD Polymers

This chapter discusses the application of initiated chemical vapor deposition (iCVD) and oxidative chemical vapor deposition (oCVD) processes for various device applications. Recent works with oCVD, especially on the energy devices, is reviewed. Some recent applications of iCVD functional polymers to optical devices, adhesives, microfluidics, and electronics devices are examined in the chapter, and merging of the iCVD with inorganic deposition methods is discussed. The iCVD process serves as an effective tool to circumvent the issues of current adhesive systems and provides a nano-adhesive layer to achieve strong bonding between the surfaces. For the deposition of inorganic layer, the most common approach is using plasma-enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD). The film quality of inorganic layer is the most critical factor that decides the barrier property of the thin-film barrier.