Passive alignment method of polymer PLC devices by using a hot embossing technique

Jin Tae Kim; Keun Byoung Yoon; Choon Gi Choi

doi:10.1109/LPT.2004.828355

Passive alignment method of polymer PLC devices by using a hot embossing technique

Jin Tae Kim, Keun Byoung Yoon, Choon Gi Choi

Electronics and Telecommunications Research Institute

Research output: Contribution to journal › Article › peer-review

39 Scopus citations

Abstract

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of ±0.5 μm. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.

Original language	English
Pages (from-to)	1664-1666
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	16
Issue number	7
DOIs	https://doi.org/10.1109/LPT.2004.828355
State	Published - Jul 2004

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abstract = "A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of ±0.5 μm. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.",

author = "Kim, {Jin Tae} and Yoon, {Keun Byoung} and Choi, {Choon Gi}",

year = "2004",

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AU - Choi, Choon Gi

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N2 - A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of ±0.5 μm. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.

AB - A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of ±0.5 μm. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.

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Passive alignment method of polymer PLC devices by using a hot embossing technique

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