Abstract
The performance of a microspectrometer fabricated in silicon using micromachining techniques is presented. The optical system is composed of two bonded silicon wafers, which have been subjected to microelectronic process compatible micromachining to co-integrate the optical components (an aluminum based grating, an optical path in crystalline silicon and array of poly-silicon thermo-couples) with readout circuits in silicon. Design considerations, fabrication and performance are presented. Measurements confirm an IR operating range between 1 and 9 μm and a half-power spectral resolution of 0.5 μm.
Original language | English |
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Pages | 707-710 |
Number of pages | 4 |
State | Published - 2003 |
Event | Proceedings of the 20th IEEE Information and Measurement Technology Conference - Vail, CO, United States Duration: 20 May 2003 → 22 May 2003 |
Conference
Conference | Proceedings of the 20th IEEE Information and Measurement Technology Conference |
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Country/Territory | United States |
City | Vail, CO |
Period | 20/05/03 → 22/05/03 |