TY - CHAP
T1 - Phase Change Material Applications in Thermal Management of Electronics and Electrical Systems
AU - Ambreen, Tehmina
AU - Saleem, Arslan
AU - Ruiz-Hincapie, Paula
AU - Kulkarni, Anirudh
AU - Ali, Hafiz Muhammad
AU - Park, Cheol Woo
N1 - Publisher Copyright:
© 2025 selection and editorial matter, Hafiz Muhammad Ali; individual chapters, the contributors.
PY - 2024/1/1
Y1 - 2024/1/1
N2 - The escalating power densities and shrinking size of electronic devices present formidable challenges in achieving effective thermal management, particularly for high-performance chips. The failure rate of electronic devices exhibits an exponential rise with escalating operating temperatures. The prevailing design trend in modern electronics, characterized by smaller and faster components, engenders elevated power densities, heightened operating temperatures, and compromised performance and longevity of electronic devices. In light of these challenges, researchers have been actively investigating the applicability of phase change materials in electronic cooling. This chapter provides an exposition of these materials as a prospective solution for electronic cooling, with a particular focus on passive and hybrid cooling methodologies. Passive cooling methods include phase change material-enhanced heat sinks, heat pipes, and phase change material-integrated thermal interface materials. Hybrid cooling systems, on the other hand, involve the integration of phase change materials in conjunction with air, liquid, and thermoelectric cooling techniques. These cooling methodologies hold immense promise in augmenting heat dissipation and averting overheating, thereby ensuring the attainment of optimal performance and prolonged lifespan for electronic devices.
AB - The escalating power densities and shrinking size of electronic devices present formidable challenges in achieving effective thermal management, particularly for high-performance chips. The failure rate of electronic devices exhibits an exponential rise with escalating operating temperatures. The prevailing design trend in modern electronics, characterized by smaller and faster components, engenders elevated power densities, heightened operating temperatures, and compromised performance and longevity of electronic devices. In light of these challenges, researchers have been actively investigating the applicability of phase change materials in electronic cooling. This chapter provides an exposition of these materials as a prospective solution for electronic cooling, with a particular focus on passive and hybrid cooling methodologies. Passive cooling methods include phase change material-enhanced heat sinks, heat pipes, and phase change material-integrated thermal interface materials. Hybrid cooling systems, on the other hand, involve the integration of phase change materials in conjunction with air, liquid, and thermoelectric cooling techniques. These cooling methodologies hold immense promise in augmenting heat dissipation and averting overheating, thereby ensuring the attainment of optimal performance and prolonged lifespan for electronic devices.
UR - http://www.scopus.com/inward/record.url?scp=85197018721&partnerID=8YFLogxK
U2 - 10.1201/9781003331957-9
DO - 10.1201/9781003331957-9
M3 - Chapter
AN - SCOPUS:85197018721
SN - 9781032359939
SP - 207
EP - 230
BT - Phase Change Materials for Thermal Energy Management and Storage
PB - CRC Press
ER -