Printing of Polymer Dielectric via Optimal Blade Coating for Large-scale Low-Leakage Capacitors

We demonstrated a polymer dielectric with low leakage characteristics through an optimal blade coating method for low-cost and large-scale fabrication of metal-insulator-metal (MIM) capacitors. Cross-linked poly (4-vinylphenol) (C-PVP), which is a typically used polymer dielectric, was coated on a 10 × 10 cm indium-tin-oxide (ITO) deposited glass substrate by changing the deposition temperature (T_D) and coating velocity (V_C) in the blade coating. During the blade coating, the thickness of the thin c-PVP varied depending on T_D and V_C owing to the ‘Landau-Levich (LL) regime’. The c-PVP-dielectric-based MIM capacitor fabricated in this study showed the lowest leakage current characteristics (10-6 A/cm² at 1.2MV/cm², annealing at 200 °C) and uniform electrical characteristics when T_D was 30 °C and V_C was 5 mm/s. In addition, at T_D = 30 °C, stable leakage characteristics were confirmed when a different electric field was applied. These results are expected to positively contribute to applications with next-generation electronic devices.