Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

Younggeun Ji; Jeonghoon Kim; Jungin Kim; Miji Lee; Jaeheon Noh; Taeyoung Jeong; Juhyeon Shin; Junho Kim; Young Heo; Ung Cho; Hyunchul Sagong; Junekyun Park; Yeonsik Choo; Gilhwan Do; Hoyoung Kang; Eunkyeong Choi; Dongyoon Sun; Changki Kang; Sangchul Shin; Sangwoo Pae

doi:10.1109/IRPS.2018.8353570

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

Younggeun Ji, Jeonghoon Kim, Jungin Kim, Miji Lee, Jaeheon Noh, Taeyoung Jeong, Juhyeon Shin, Junho Kim, Young Heo, Ung Cho, Hyunchul Sagong, Junekyun Park, Yeonsik Choo, Gilhwan Do, Hoyoung Kang, Eunkyeong Choi, Dongyoon Sun, Changki Kang, Sangchul Shin, Sangwoo Pae

Department of Biology

Samsung

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Due to the advancement of CMOS image sensors (CIS), camera module on the mobile platform has paved way for very high quality photos and video shooting capability. In order to improve picture quality, the CIS technology has been also scaling aggressively to provide more Mega-Pixels (MP) but it also must be less susceptible and immune to noise sources, particle and defect-free, and highly reliable. In this report, we'll discuss the reliability characterization done on the 3D stack sensor with in-pixel DTI. By optimization of both process and design, noise immune and very high quality advanced CIS products have been successfully qualified and manufactured for volume production.

Original language	English
Title of host publication	2018 IEEE International Reliability Physics Symposium, IRPS 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	3D.31-3D.34
ISBN (Electronic)	9781538654798
DOIs	https://doi.org/10.1109/IRPS.2018.8353570
State	Published - 25 May 2018
Event	2018 IEEE International Reliability Physics Symposium, IRPS 2018 - Burlingame, United States Duration: 11 Mar 2018 → 15 Mar 2018

Publication series

Name	IEEE International Reliability Physics Symposium Proceedings
Volume	2018-March
ISSN (Print)	1541-7026

Conference

Conference	2018 IEEE International Reliability Physics Symposium, IRPS 2018
Country/Territory	United States
City	Burlingame
Period	11/03/18 → 15/03/18

Keywords

CMOS Image Sensor (CIS)
Dark noise
HTOL
Particle
Production
RTS
Reliability

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10.1109/IRPS.2018.8353570

Cite this

Ji, Y., Kim, J., Kim, J., Lee, M., Noh, J., Jeong, T., Shin, J., Kim, J., Heo, Y., Cho, U., Sagong, H., Park, J., Choo, Y., Do, G., Kang, H., Choi, E., Sun, D., Kang, C., Shin, S., & Pae, S. (2018). Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. In 2018 IEEE International Reliability Physics Symposium, IRPS 2018 (pp. 3D.31-3D.34). (IEEE International Reliability Physics Symposium Proceedings; Vol. 2018-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IRPS.2018.8353570

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title = "Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI",

abstract = "Due to the advancement of CMOS image sensors (CIS), camera module on the mobile platform has paved way for very high quality photos and video shooting capability. In order to improve picture quality, the CIS technology has been also scaling aggressively to provide more Mega-Pixels (MP) but it also must be less susceptible and immune to noise sources, particle and defect-free, and highly reliable. In this report, we'll discuss the reliability characterization done on the 3D stack sensor with in-pixel DTI. By optimization of both process and design, noise immune and very high quality advanced CIS products have been successfully qualified and manufactured for volume production.",

keywords = "CMOS Image Sensor (CIS), Dark noise, HTOL, Particle, Production, RTS, Reliability",

author = "Younggeun Ji and Jeonghoon Kim and Jungin Kim and Miji Lee and Jaeheon Noh and Taeyoung Jeong and Juhyeon Shin and Junho Kim and Young Heo and Ung Cho and Hyunchul Sagong and Junekyun Park and Yeonsik Choo and Gilhwan Do and Hoyoung Kang and Eunkyeong Choi and Dongyoon Sun and Changki Kang and Sangchul Shin and Sangwoo Pae",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE International Reliability Physics Symposium, IRPS 2018 ; Conference date: 11-03-2018 Through 15-03-2018",

year = "2018",

month = may,

day = "25",

doi = "10.1109/IRPS.2018.8353570",

language = "English",

series = "IEEE International Reliability Physics Symposium Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "3D.31--3D.34",

booktitle = "2018 IEEE International Reliability Physics Symposium, IRPS 2018",

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Ji, Y, Kim, J, Kim, J, Lee, M, Noh, J, Jeong, T, Shin, J, Kim, J, Heo, Y, Cho, U, Sagong, H, Park, J, Choo, Y, Do, G, Kang, H, Choi, E, Sun, D, Kang, C, Shin, S & Pae, S 2018, Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. in 2018 IEEE International Reliability Physics Symposium, IRPS 2018. IEEE International Reliability Physics Symposium Proceedings, vol. 2018-March, Institute of Electrical and Electronics Engineers Inc., pp. 3D.31-3D.34, 2018 IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, United States, 11/03/18. https://doi.org/10.1109/IRPS.2018.8353570

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. / Ji, Younggeun; Kim, Jeonghoon; Kim, Jungin et al.
2018 IEEE International Reliability Physics Symposium, IRPS 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 3D.31-3D.34 (IEEE International Reliability Physics Symposium Proceedings; Vol. 2018-March).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Ji, Younggeun

AU - Kim, Jeonghoon

AU - Kim, Jungin

AU - Lee, Miji

AU - Noh, Jaeheon

AU - Jeong, Taeyoung

AU - Shin, Juhyeon

AU - Kim, Junho

AU - Heo, Young

AU - Cho, Ung

AU - Sagong, Hyunchul

AU - Park, Junekyun

AU - Choo, Yeonsik

AU - Do, Gilhwan

AU - Kang, Hoyoung

AU - Choi, Eunkyeong

AU - Sun, Dongyoon

AU - Kang, Changki

AU - Shin, Sangchul

AU - Pae, Sangwoo

PY - 2018/5/25

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N2 - Due to the advancement of CMOS image sensors (CIS), camera module on the mobile platform has paved way for very high quality photos and video shooting capability. In order to improve picture quality, the CIS technology has been also scaling aggressively to provide more Mega-Pixels (MP) but it also must be less susceptible and immune to noise sources, particle and defect-free, and highly reliable. In this report, we'll discuss the reliability characterization done on the 3D stack sensor with in-pixel DTI. By optimization of both process and design, noise immune and very high quality advanced CIS products have been successfully qualified and manufactured for volume production.

AB - Due to the advancement of CMOS image sensors (CIS), camera module on the mobile platform has paved way for very high quality photos and video shooting capability. In order to improve picture quality, the CIS technology has been also scaling aggressively to provide more Mega-Pixels (MP) but it also must be less susceptible and immune to noise sources, particle and defect-free, and highly reliable. In this report, we'll discuss the reliability characterization done on the 3D stack sensor with in-pixel DTI. By optimization of both process and design, noise immune and very high quality advanced CIS products have been successfully qualified and manufactured for volume production.

KW - CMOS Image Sensor (CIS)

KW - Dark noise

KW - HTOL

KW - Particle

KW - Production

KW - RTS

KW - Reliability

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AN - SCOPUS:85046954868

T3 - IEEE International Reliability Physics Symposium Proceedings

SP - 3D.31-3D.34

BT - 2018 IEEE International Reliability Physics Symposium, IRPS 2018

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 IEEE International Reliability Physics Symposium, IRPS 2018

Y2 - 11 March 2018 through 15 March 2018

ER -

Ji Y, Kim J, Kim J, Lee M, Noh J, Jeong T et al. Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. In 2018 IEEE International Reliability Physics Symposium, IRPS 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 3D.31-3D.34. (IEEE International Reliability Physics Symposium Proceedings). doi: 10.1109/IRPS.2018.8353570

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

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Keywords

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