"SAMs meet MEMS": Surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

B. J. Kim; G. M. Kim; M. Liebau; J. Huskens; D. N. Reinhoudt; J. Brugger

"SAMs meet MEMS": Surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

B. J. Kim
, G. M. Kim
, M. Liebau
, J. Huskens
, D. N. Reinhoudt
, J. Brugger

School of Mechanical Engineering

University of Twente

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

The use of self-assembled monolayers (SAM) as anti-adhesion coating was demonstrated to assist the removal of photoplastic microelectromechanical systems (MEMS). The SAMs reduces the stiction between the surface and a thin evaporated metal film. It also provids stability to support subsequent micromachining steps. The method allowed the fabrication of novel surface micromachined structures, including high-aspect ratio plastic devices and embedded bottom-side metal micro-and nanoscale electrode pattern.

Original language	English
Pages	106-109
Number of pages	4
State	Published - 2001
Event	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland Duration: 21 Jan 2001 → 25 Jan 2001

Conference

Conference	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
Country/Territory	Switzerland
City	Interlaken
Period	21/01/01 → 25/01/01

Cite this

@conference{c6ce2e476a8d45068ff513fff45ecfaf,

title = "{"}SAMs meet MEMS{"}: Surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS",

abstract = "The use of self-assembled monolayers (SAM) as anti-adhesion coating was demonstrated to assist the removal of photoplastic microelectromechanical systems (MEMS). The SAMs reduces the stiction between the surface and a thin evaporated metal film. It also provids stability to support subsequent micromachining steps. The method allowed the fabrication of novel surface micromachined structures, including high-aspect ratio plastic devices and embedded bottom-side metal micro-and nanoscale electrode pattern.",

author = "Kim, \{B. J.\} and Kim, \{G. M.\} and M. Liebau and J. Huskens and Reinhoudt, \{D. N.\} and J. Brugger",

year = "2001",

language = "English",

pages = "106--109",

note = "14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) ; Conference date: 21-01-2001 Through 25-01-2001",

}

"SAMs meet MEMS": Surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS. / Kim, B. J.; Kim, G. M.; Liebau, M. et al.
2001. 106-109 Paper presented at 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001), Interlaken, Switzerland.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - "SAMs meet MEMS"

T2 - 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)

AU - Kim, B. J.

AU - Kim, G. M.

AU - Liebau, M.

AU - Huskens, J.

AU - Reinhoudt, D. N.

AU - Brugger, J.

PY - 2001

Y1 - 2001

N2 - The use of self-assembled monolayers (SAM) as anti-adhesion coating was demonstrated to assist the removal of photoplastic microelectromechanical systems (MEMS). The SAMs reduces the stiction between the surface and a thin evaporated metal film. It also provids stability to support subsequent micromachining steps. The method allowed the fabrication of novel surface micromachined structures, including high-aspect ratio plastic devices and embedded bottom-side metal micro-and nanoscale electrode pattern.

AB - The use of self-assembled monolayers (SAM) as anti-adhesion coating was demonstrated to assist the removal of photoplastic microelectromechanical systems (MEMS). The SAMs reduces the stiction between the surface and a thin evaporated metal film. It also provids stability to support subsequent micromachining steps. The method allowed the fabrication of novel surface micromachined structures, including high-aspect ratio plastic devices and embedded bottom-side metal micro-and nanoscale electrode pattern.

UR - https://www.scopus.com/pages/publications/0034996177

M3 - Paper

AN - SCOPUS:0034996177

SP - 106

EP - 109

Y2 - 21 January 2001 through 25 January 2001

ER -

"SAMs meet MEMS": Surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

Abstract

Conference

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