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Scalability of sub-100 nm InAs HEMTs on InP substrate for future logic applications

  • Massachusetts Institute of Technology

Research output: Contribution to journalArticlepeer-review

56 Scopus citations

Abstract

We have experimentally studied the scaling behavior of sub-100-nm InAs high-electron mobility transistors (HEMTs) on InP substrate from the logic operation point of view. These devices have been designed for scalability and combine a thin InAlAs barrier and a thin channel containing a pure InAs subchannel. InAs HEMTs with gate length down to 40 nm exhibit excellent logic figures of merit, such as ION/IOFF= 9104, drain-induced-barrier lowering = 80 mV/V , S = 70\ mV/dec , and an estimated logic gate delay of 0.6 ps at VDS = 0.5V . In addition, we have obtained excellent high-frequency operation with Lg = 40nm , such as fT = 491GHz and fmax = 402GHz at VDS = 0.5V . In spite of the narrow bandgap of InAs subchannel, under the studied conditions, our devices are shown not to suffer from excessive band-to-band tunneling. When benchmarked against state-of-the-art Si devices, 40-nm InAs HEMTs exhibit ION0.6Am at ILeak = 200n μm . This is about two times higher ION than state-of-the-art high-performance 65-nm nMOSFET with comparable physical gate length and ILeak .

Original languageEnglish
Article number5475311
Pages (from-to)1504-1511
Number of pages8
JournalIEEE Transactions on Electron Devices
Volume57
Issue number7
DOIs
StatePublished - Jul 2010

Keywords

  • Drain-induced barrier lowering (DIBL)
  • gate delay
  • high-electron mobility transistor (HEMT)
  • IOFF
  • InAs
  • logic
  • scaling
  • subthreshold swing

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