Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer

Insic Hong; Yeonwook Roh; Je Sung Koh; Seonyeob Na; Taewi Kim; Eunhan Lee; Hyeongi An; Jinhyeong Kwon; Junyeob Yeo; Sukjoon Hong; Kyu Tae Lee; Daeshik Kang; Seung Hwan Ko; Seungyong Han

doi:10.1002/admt.201800422

Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer

Insic Hong, Yeonwook Roh, Je Sung Koh, Seonyeob Na, Taewi Kim, Eunhan Lee, Hyeongi An, Jinhyeong Kwon, Junyeob Yeo, Sukjoon Hong, Kyu Tae Lee, Daeshik Kang, Seung Hwan Ko, Seungyong Han

Research output: Contribution to journal › Article › peer-review

33 Scopus citations

Abstract

Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (≈350 °C) and in underwater, acidic chemical, and abrasive conditions.

Original language	English
Article number	1800422
Journal	Advanced Materials Technologies
Volume	4
Issue number	4
DOIs	https://doi.org/10.1002/admt.201800422
State	Published - Apr 2019

Keywords

copper nanowires
CuPSP structures
flexible microheaters
oxidation

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10.1002/admt.201800422

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title = "Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer",

abstract = "Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (≈350 °C) and in underwater, acidic chemical, and abrasive conditions.",

keywords = "copper nanowires, CuPSP structures, flexible microheaters, oxidation",

author = "Insic Hong and Yeonwook Roh and Koh, {Je Sung} and Seonyeob Na and Taewi Kim and Eunhan Lee and Hyeongi An and Jinhyeong Kwon and Junyeob Yeo and Sukjoon Hong and Lee, {Kyu Tae} and Daeshik Kang and Ko, {Seung Hwan} and Seungyong Han",

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year = "2019",

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doi = "10.1002/admt.201800422",

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T1 - Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer

AU - Hong, Insic

AU - Roh, Yeonwook

AU - Koh, Je Sung

AU - Na, Seonyeob

AU - Kim, Taewi

AU - Lee, Eunhan

AU - An, Hyeongi

AU - Kwon, Jinhyeong

AU - Yeo, Junyeob

AU - Hong, Sukjoon

AU - Lee, Kyu Tae

AU - Kang, Daeshik

AU - Ko, Seung Hwan

AU - Han, Seungyong

PY - 2019/4

Y1 - 2019/4

N2 - Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (≈350 °C) and in underwater, acidic chemical, and abrasive conditions.

AB - Copper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in terms of oxidation prevention at certain temperatures, leaving the matter of oxidation at high temperatures unresolved. In this article, a simple encapsulation structure made of a polyimide and SiOx thin film is presented that effectively prevents the penetration of oxygen and moisture into the Cu NW network. This structure, furthermore, boasts excellent stability at high temperature (≈350 °C) and in underwater, acidic chemical, and abrasive conditions.

KW - copper nanowires

KW - CuPSP structures

KW - flexible microheaters

KW - oxidation

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DO - 10.1002/admt.201800422

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ER -

Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer

Abstract

Keywords

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