Simulation and Analysis of MEMS-Based Flexible Capacitive Pressure Sensors with COMSOL

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

We employ COMSOL Multiphysics to develop and analyze a novel tri-layered MEMS-based capacitive pressure sensor. The sensor comprises gold electrodes, a composite dielectric layer consisting of silver nanowires (AgNWs) embedded in thermoplastic polyurethane (TPU), and a polydimethylsiloxane substrate. This study investigates the impact of variations in design parameters of the AgNW/TPU dielectric layer - specifically thickness and area - on sensor performance from 0 Pa to 15 kPa. The focus is on the sensor's response across different pressure levels, particularly at the maximum of 15 kPa. Preliminary simulation results indicate potential for performance enhancement. Future work will further optimize sensor sensitivity and accuracy by simulating additional three-dimensional dielectric layer configurations.

Original languageEnglish
Title of host publication2024 International Convention on Rehabilitation Engineering and Assistive Technology and World Rehabilitation Robot Convention, WRRC 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350355123
DOIs
StatePublished - 2024
Event2024 International Convention on Rehabilitation Engineering and Assistive Technology and World Rehabilitation Robot Convention, i-CREATE and WRRC 2024 - Shanghai, China
Duration: 23 Aug 202426 Aug 2024

Publication series

Name2024 International Convention on Rehabilitation Engineering and Assistive Technology and World Rehabilitation Robot Convention, WRRC 2024 - Proceedings

Conference

Conference2024 International Convention on Rehabilitation Engineering and Assistive Technology and World Rehabilitation Robot Convention, i-CREATE and WRRC 2024
Country/TerritoryChina
CityShanghai
Period23/08/2426/08/24

Keywords

  • 3D modeling
  • COMSOL Multiphysics
  • flexible sensors
  • MEMS
  • sensor durability

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