Stability of metal electrodes for MLCC with BaTiO3 thin layers by deposition method

Sang Shik Park

doi:10.1080/10584580500413970

Stability of metal electrodes for MLCC with BaTiO₃ thin layers by deposition method

Sang Shik Park

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and Ni-Cr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10^-6 Ω-cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr ₂O₄ phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor, of Al/BaTiO ₃/Al was more stable than NiCr/BaTiO₃/NiCr structure. The NiCr/BaTiO₃/NiCr structure showed higher leakage current than that of Al/BaTiO₃/Al.

Original language	English
Pages (from-to)	95-102
Number of pages	8
Journal	Integrated Ferroelectrics
Volume	74
DOIs	https://doi.org/10.1080/10584580500413970
State	Published - 2005
Event	Seventeenth International Symposium on Integrated Ferroelectrics, ISIF-17 - Shanghai, China Duration: 17 Apr 2005 → 20 Apr 2005

Keywords

Base metal electrode
Capacitance change
Leakage current
Resistivity
Roughness

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10.1080/10584580500413970

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@article{b779bdd93c37419fa5876b94ee166a08,

title = "Stability of metal electrodes for MLCC with BaTiO3 thin layers by deposition method",

abstract = "The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and Ni-Cr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10-6 Ω-cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr 2O4 phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor, of Al/BaTiO 3/Al was more stable than NiCr/BaTiO3/NiCr structure. The NiCr/BaTiO3/NiCr structure showed higher leakage current than that of Al/BaTiO3/Al.",

keywords = "Base metal electrode, Capacitance change, Leakage current, Resistivity, Roughness",

author = "Park, {Sang Shik}",

year = "2005",

doi = "10.1080/10584580500413970",

language = "English",

volume = "74",

pages = "95--102",

journal = "Integrated Ferroelectrics",

issn = "1058-4587",

publisher = "Taylor and Francis Ltd.",

note = "Seventeenth International Symposium on Integrated Ferroelectrics, ISIF-17 ; Conference date: 17-04-2005 Through 20-04-2005",

}

TY - JOUR

T1 - Stability of metal electrodes for MLCC with BaTiO3 thin layers by deposition method

AU - Park, Sang Shik

PY - 2005

Y1 - 2005

N2 - The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and Ni-Cr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10-6 Ω-cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr 2O4 phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor, of Al/BaTiO 3/Al was more stable than NiCr/BaTiO3/NiCr structure. The NiCr/BaTiO3/NiCr structure showed higher leakage current than that of Al/BaTiO3/Al.

AB - The stability of various base metal electrodes was examined for the preparation of MLCC by deposition method. The electrical resistivity of Al and Ni-Cr was lower than Ni and Cu and the Cu and Ni films showed a poor adhesion with Si substrate. The resistivity of Al film was 4 × 10-6 Ω-cm. Ni-Cr film deposited at room temperature have a columnar structure and higher roughness than Al films. As-deposited Al and NiCr show the rms roughness of 35 and 145 A, respectively and Al films showed the very stable structure after annealing. NiCr films show the formation of NiCr 2O4 phase at surface after annealing. The capacitance change with electrodes was neglectable but dissipation factor, of Al/BaTiO 3/Al was more stable than NiCr/BaTiO3/NiCr structure. The NiCr/BaTiO3/NiCr structure showed higher leakage current than that of Al/BaTiO3/Al.

KW - Base metal electrode

KW - Capacitance change

KW - Leakage current

KW - Resistivity

KW - Roughness

UR - http://www.scopus.com/inward/record.url?scp=33645519851&partnerID=8YFLogxK

U2 - 10.1080/10584580500413970

DO - 10.1080/10584580500413970

M3 - Conference article

AN - SCOPUS:33645519851

SN - 1058-4587

VL - 74

SP - 95

EP - 102

JO - Integrated Ferroelectrics

JF - Integrated Ferroelectrics

T2 - Seventeenth International Symposium on Integrated Ferroelectrics, ISIF-17

Y2 - 17 April 2005 through 20 April 2005

ER -

Stability of metal electrodes for MLCC with BaTiO₃ thin layers by deposition method

Abstract

Keywords

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