Abstract
The etching rate of bulk ZnO in Cl2/Ar high density plasmas was discussed. Ion-assisted desorption of the ZnClx etch products was performed. It was found that the amount of residual chlorine on the ZnO surface decreases with increasing etch temperature.
| Original language | English |
|---|---|
| Pages (from-to) | 3105-3107 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 83 |
| Issue number | 15 |
| DOIs | |
| State | Published - 13 Oct 2003 |