TY - GEN
T1 - Thermal analysis and optimization of 2.5-D integrated voltage regulator
AU - Song, Taigon
AU - Sturcken, Noah
AU - Athikulwongse, Krit
AU - Shepard, Kenneth
AU - Lim, Sung Kyu
PY - 2012
Y1 - 2012
N2 - Integrated voltage regulators (IVRs) promise to improve performance-per-watt for microprocessors and systems-on-chip by reducing supply voltage margins, resistive losses in the power distribution network, and by enabling power management with greater temporal resolution. However, the thermal impact of IVRs has not been well studied, and the methodologies for thermal analysis of analog/digital mixed-signal designs, such as voltage regulators on chip, have not yet been developed. In this paper, we present a thermal analysis methodology for 2.5-D IVR. Our results show that (1) the integrated power inductor is the hottest component in the IVR, and (2) the temperature of the IVR rises rapidly when the power inductor and the circuitries of the IVR chip overlap. In order to address these issues, we propose two design optimization techniques: design block relocation and inductor spreading. Related experiments show the effectiveness of these methods.
AB - Integrated voltage regulators (IVRs) promise to improve performance-per-watt for microprocessors and systems-on-chip by reducing supply voltage margins, resistive losses in the power distribution network, and by enabling power management with greater temporal resolution. However, the thermal impact of IVRs has not been well studied, and the methodologies for thermal analysis of analog/digital mixed-signal designs, such as voltage regulators on chip, have not yet been developed. In this paper, we present a thermal analysis methodology for 2.5-D IVR. Our results show that (1) the integrated power inductor is the hottest component in the IVR, and (2) the temperature of the IVR rises rapidly when the power inductor and the circuitries of the IVR chip overlap. In order to address these issues, we propose two design optimization techniques: design block relocation and inductor spreading. Related experiments show the effectiveness of these methods.
KW - Analog
KW - Integrated Voltage Regulator
KW - Mixed System
KW - Silicon Interposer
KW - Thermal Analysis
UR - http://www.scopus.com/inward/record.url?scp=84874488590&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2012.6457835
DO - 10.1109/EPEPS.2012.6457835
M3 - Conference contribution
AN - SCOPUS:84874488590
SN - 9781467325394
T3 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
SP - 25
EP - 28
BT - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
T2 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Y2 - 21 October 2012 through 24 October 2012
ER -