Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

S. H. Park; D. B. Kim; R. G. Lee; I. J. Son

doi:10.1515/amm-2017-0197

Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

S. H. Park, D. B. Kim, R. G. Lee, I. J. Son

Daegu Mechatronics and Materials Institute

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm^-1K^-1 and 8 to 5 ppm k^-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.

Original language	English
Pages (from-to)	1303-1306
Number of pages	4
Journal	Archives of Metallurgy and Materials
Volume	62
Issue number	2
DOIs	https://doi.org/10.1515/amm-2017-0197
State	Published - 1 Jun 2017

Keywords

Interfacial bonding
Metal matrix composites
Spark plasma sintering
Thermal conductivity
Thermal expansion

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title = "Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process",

abstract = "This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.",

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author = "Park, {S. H.} and Kim, {D. B.} and Lee, {R. G.} and Son, {I. J.}",

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N2 - This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.

AB - This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.

KW - Interfacial bonding

KW - Metal matrix composites

KW - Spark plasma sintering

KW - Thermal conductivity

KW - Thermal expansion

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Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

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Keywords

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