Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process

S. H. Park, D. B. Kim, R. G. Lee, I. J. Son

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.

Original languageEnglish
Pages (from-to)1303-1306
Number of pages4
JournalArchives of Metallurgy and Materials
Volume62
Issue number2
DOIs
StatePublished - 1 Jun 2017

Keywords

  • Interfacial bonding
  • Metal matrix composites
  • Spark plasma sintering
  • Thermal conductivity
  • Thermal expansion

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