Thermal impact study of block folding and face-to-face bonding in 3D IC

Yarui Peng; Moongon Jung; Taigon Song; Yang Wan; Sung Kyu Lim

doi:10.1109/IITC-MAM.2015.7325593

Thermal impact study of block folding and face-to-face bonding in 3D IC

Yarui Peng, Moongon Jung, Taigon Song, Yang Wan, Sung Kyu Lim

School of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

In this paper we study the thermal impact of two high impact design/technology choices for 3D ICs, i.e., block folding and face-to-face bonding. A recent study shows that block folding and face-to-face improve wirelength, power, and performance, but the impact on thermal issue is not studied. Based on commercial-quality 3D IC layouts of large-scale OpenSPARC T2 designs and a highly accurate GDSII-level thermal analysis flow, our results first show that block folding, despite its power density increase, does not worsen thermal issues because of additional TSVs that act as heat conductors. In addition, face-to-face bonding, despite its thermal benefit from the absence of BCB bonding layer and underfill, still does not improve temperature much because of the small F2F via sizes.

Original language	English
Title of host publication	2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	331-333
Number of pages	3
ISBN (Electronic)	9781467373562
DOIs	https://doi.org/10.1109/IITC-MAM.2015.7325593
State	Published - 10 Nov 2015
Event	IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 - Grenoble, France Duration: 18 May 2015 → 21 May 2015

Publication series

Name	2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

Conference

Conference	IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
Country/Territory	France
City	Grenoble
Period	18/05/15 → 21/05/15

Keywords

Bonding
Conductivity
Heating
Thermal analysis
Thermal conductivity
Three-dimensional displays
Through-silicon vias

Access to Document

10.1109/IITC-MAM.2015.7325593

Cite this

Peng, Y., Jung, M., Song, T., Wan, Y., & Lim, S. K. (2015). Thermal impact study of block folding and face-to-face bonding in 3D IC. In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 (pp. 331-333). Article 7325593 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC-MAM.2015.7325593

Peng, Yarui ; Jung, Moongon ; Song, Taigon et al. / Thermal impact study of block folding and face-to-face bonding in 3D IC. 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 331-333 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015).

@inproceedings{eb514e53518f4acf8b9c9764fe7b37bf,

title = "Thermal impact study of block folding and face-to-face bonding in 3D IC",

abstract = "In this paper we study the thermal impact of two high impact design/technology choices for 3D ICs, i.e., block folding and face-to-face bonding. A recent study shows that block folding and face-to-face improve wirelength, power, and performance, but the impact on thermal issue is not studied. Based on commercial-quality 3D IC layouts of large-scale OpenSPARC T2 designs and a highly accurate GDSII-level thermal analysis flow, our results first show that block folding, despite its power density increase, does not worsen thermal issues because of additional TSVs that act as heat conductors. In addition, face-to-face bonding, despite its thermal benefit from the absence of BCB bonding layer and underfill, still does not improve temperature much because of the small F2F via sizes.",

keywords = "Bonding, Conductivity, Heating, Thermal analysis, Thermal conductivity, Three-dimensional displays, Through-silicon vias",

author = "Yarui Peng and Moongon Jung and Taigon Song and Yang Wan and Lim, {Sung Kyu}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 ; Conference date: 18-05-2015 Through 21-05-2015",

year = "2015",

month = nov,

day = "10",

doi = "10.1109/IITC-MAM.2015.7325593",

language = "English",

series = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "331--333",

booktitle = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",

address = "United States",

}

Peng, Y, Jung, M, Song, T, Wan, Y & Lim, SK 2015, Thermal impact study of block folding and face-to-face bonding in 3D IC. in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015., 7325593, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015, Institute of Electrical and Electronics Engineers Inc., pp. 331-333, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015, Grenoble, France, 18/05/15. https://doi.org/10.1109/IITC-MAM.2015.7325593

Thermal impact study of block folding and face-to-face bonding in 3D IC. / Peng, Yarui; Jung, Moongon; Song, Taigon et al.
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 331-333 7325593 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Thermal impact study of block folding and face-to-face bonding in 3D IC

AU - Peng, Yarui

AU - Jung, Moongon

AU - Song, Taigon

AU - Wan, Yang

AU - Lim, Sung Kyu

PY - 2015/11/10

Y1 - 2015/11/10

N2 - In this paper we study the thermal impact of two high impact design/technology choices for 3D ICs, i.e., block folding and face-to-face bonding. A recent study shows that block folding and face-to-face improve wirelength, power, and performance, but the impact on thermal issue is not studied. Based on commercial-quality 3D IC layouts of large-scale OpenSPARC T2 designs and a highly accurate GDSII-level thermal analysis flow, our results first show that block folding, despite its power density increase, does not worsen thermal issues because of additional TSVs that act as heat conductors. In addition, face-to-face bonding, despite its thermal benefit from the absence of BCB bonding layer and underfill, still does not improve temperature much because of the small F2F via sizes.

AB - In this paper we study the thermal impact of two high impact design/technology choices for 3D ICs, i.e., block folding and face-to-face bonding. A recent study shows that block folding and face-to-face improve wirelength, power, and performance, but the impact on thermal issue is not studied. Based on commercial-quality 3D IC layouts of large-scale OpenSPARC T2 designs and a highly accurate GDSII-level thermal analysis flow, our results first show that block folding, despite its power density increase, does not worsen thermal issues because of additional TSVs that act as heat conductors. In addition, face-to-face bonding, despite its thermal benefit from the absence of BCB bonding layer and underfill, still does not improve temperature much because of the small F2F via sizes.

KW - Bonding

KW - Conductivity

KW - Heating

KW - Thermal analysis

KW - Thermal conductivity

KW - Three-dimensional displays

KW - Through-silicon vias

UR - http://www.scopus.com/inward/record.url?scp=84961882167&partnerID=8YFLogxK

U2 - 10.1109/IITC-MAM.2015.7325593

DO - 10.1109/IITC-MAM.2015.7325593

M3 - Conference contribution

AN - SCOPUS:84961882167

T3 - 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

SP - 331

EP - 333

BT - 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

Y2 - 18 May 2015 through 21 May 2015

ER -

Peng Y, Jung M, Song T, Wan Y, Lim SK. Thermal impact study of block folding and face-to-face bonding in 3D IC. In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 331-333. 7325593. (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015). doi: 10.1109/IITC-MAM.2015.7325593

Thermal impact study of block folding and face-to-face bonding in 3D IC

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