Thermo-dependent characteristics of polyimide-graphene composites

Minsoo Koo; Jong Seong Bae; Seong Eun Shim; Dongmin Kim; Dae Geun Nam; Jae Won Lee; Gang Woo Lee; Jeong Hyun Yeum; Weontae Oh

doi:10.1007/s00396-011-2469-x

Thermo-dependent characteristics of polyimide-graphene composites

Minsoo Koo, Jong Seong Bae, Seong Eun Shim, Dongmin Kim, Dae Geun Nam, Jae Won Lee, Gang Woo Lee, Jeong Hyun Yeum, Weontae Oh

Department of Biofibers and Biomaterials Science

Research output: Contribution to journal › Article › peer-review

45 Scopus citations

Abstract

Polyimide-graphene composites (PIG) were prepared with variable amounts of graphene, and their thermal properties were analyzed in films on substrates or sheet states. The thermal conductivities of PIG composite sheets gradually moved upwards with increase of graphene loading. Coefficient of thermal expansion of composite sheet was higher in out-of-plane mode than in-plane mode. The residual stress of a composite film was monotonously changed in accordance with the variation of temperature and lowered with increase of graphene. In addition, the residual stress of a composite film reached to the initial stress value during cooling process after heating. The stress profiles on further heating and cooling runs closely followed the stress profile during the first cooing run.

Original language	English
Pages (from-to)	1503-1509
Number of pages	7
Journal	Colloid and Polymer Science
Volume	289
Issue number	13
DOIs	https://doi.org/10.1007/s00396-011-2469-x
State	Published - Aug 2011

Keywords

Graphene
Polyimide
Residual stress
Thermal conductivity
Thermal expansion

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10.1007/s00396-011-2469-x

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title = "Thermo-dependent characteristics of polyimide-graphene composites",

abstract = "Polyimide-graphene composites (PIG) were prepared with variable amounts of graphene, and their thermal properties were analyzed in films on substrates or sheet states. The thermal conductivities of PIG composite sheets gradually moved upwards with increase of graphene loading. Coefficient of thermal expansion of composite sheet was higher in out-of-plane mode than in-plane mode. The residual stress of a composite film was monotonously changed in accordance with the variation of temperature and lowered with increase of graphene. In addition, the residual stress of a composite film reached to the initial stress value during cooling process after heating. The stress profiles on further heating and cooling runs closely followed the stress profile during the first cooing run.",

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T1 - Thermo-dependent characteristics of polyimide-graphene composites

AU - Koo, Minsoo

AU - Bae, Jong Seong

AU - Shim, Seong Eun

AU - Kim, Dongmin

AU - Nam, Dae Geun

AU - Lee, Jae Won

AU - Lee, Gang Woo

AU - Yeum, Jeong Hyun

AU - Oh, Weontae

PY - 2011/8

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N2 - Polyimide-graphene composites (PIG) were prepared with variable amounts of graphene, and their thermal properties were analyzed in films on substrates or sheet states. The thermal conductivities of PIG composite sheets gradually moved upwards with increase of graphene loading. Coefficient of thermal expansion of composite sheet was higher in out-of-plane mode than in-plane mode. The residual stress of a composite film was monotonously changed in accordance with the variation of temperature and lowered with increase of graphene. In addition, the residual stress of a composite film reached to the initial stress value during cooling process after heating. The stress profiles on further heating and cooling runs closely followed the stress profile during the first cooing run.

AB - Polyimide-graphene composites (PIG) were prepared with variable amounts of graphene, and their thermal properties were analyzed in films on substrates or sheet states. The thermal conductivities of PIG composite sheets gradually moved upwards with increase of graphene loading. Coefficient of thermal expansion of composite sheet was higher in out-of-plane mode than in-plane mode. The residual stress of a composite film was monotonously changed in accordance with the variation of temperature and lowered with increase of graphene. In addition, the residual stress of a composite film reached to the initial stress value during cooling process after heating. The stress profiles on further heating and cooling runs closely followed the stress profile during the first cooing run.

KW - Graphene

KW - Polyimide

KW - Residual stress

KW - Thermal conductivity

KW - Thermal expansion

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Thermo-dependent characteristics of polyimide-graphene composites

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Keywords

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