Three-tier 3D ICs for more power reduction: Strategies in CAD, design, and bonding selection
- Taigon Song
- , Shreepad Panth
- , Yoo Jin Chae
- , Sung Kyu Lim
- Altera Corporation
- Korea Advanced Institute of Science and Technology
- Georgia Institute of Technology
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
7
Scopus
citations