Wafer bonding between InP and Ce:YIG(CeY2Fe5O 12) using O2 plasma surface activation for an integrated optical waveguide isolator

J. W. Roh; J. S. Yang; S. H. Ok; D. H. Woo; Y. T. Byun; Y. M. Jhon; T. Mizumoto; W. Y. Lee; S. Lee

doi:10.1117/12.648371

Wafer bonding between InP and Ce:YIG(CeY₂Fe₅O ₁₂) using O₂ plasma surface activation for an integrated optical waveguide isolator

J. W. Roh, J. S. Yang, S. H. Ok, D. H. Woo, Y. T. Byun, Y. M. Jhon, T. Mizumoto, W. Y. Lee, S. Lee

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

The wafer bonding of III-V semiconductor materials with garnet thin films has become of increasing technological importance in integration of optical components. The wafer bonding between InP wafer and GGG was demonstrated by using O₂ plasma surface activation. The same process was applied to the bonding process of InP/Ce:YIG, which is indispensable for the fabrication of an integrated optical waveguide isolator.

Original language	English
Title of host publication	Integrated Optics
Subtitle of host publication	Devices, Materials, and Technologies X
DOIs	https://doi.org/10.1117/12.648371
State	Published - 2006
Event	Integrated Optics: Devices, Materials, and Technologies X - San Jose, CA, United States Duration: 23 Jan 2006 → 25 Jan 2006

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6123
ISSN (Print)	0277-786X

Conference

Conference	Integrated Optics: Devices, Materials, and Technologies X
Country/Territory	United States
City	San Jose, CA
Period	23/01/06 → 25/01/06

Keywords

Ce:YIG
GGG
Integrated optical waveguide isolator
O plasma surface activation
Photonic integrated circuits
Wafer bonding

Access to Document

10.1117/12.648371

Cite this

Roh, J. W., Yang, J. S., Ok, S. H., Woo, D. H., Byun, Y. T., Jhon, Y. M., Mizumoto, T., Lee, W. Y., & Lee, S. (2006). Wafer bonding between InP and Ce:YIG(CeY₂Fe₅O ₁₂) using O₂ plasma surface activation for an integrated optical waveguide isolator. In Integrated Optics: Devices, Materials, and Technologies X Article 612316 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6123). https://doi.org/10.1117/12.648371

@inproceedings{efdecdd3a8e04d458167d87b25388d2a,

title = "Wafer bonding between InP and Ce:YIG(CeY2Fe5O 12) using O2 plasma surface activation for an integrated optical waveguide isolator",

abstract = "The wafer bonding of III-V semiconductor materials with garnet thin films has become of increasing technological importance in integration of optical components. The wafer bonding between InP wafer and GGG was demonstrated by using O2 plasma surface activation. The same process was applied to the bonding process of InP/Ce:YIG, which is indispensable for the fabrication of an integrated optical waveguide isolator.",

keywords = "Ce:YIG, GGG, Integrated optical waveguide isolator, O plasma surface activation, Photonic integrated circuits, Wafer bonding",

author = "Roh, {J. W.} and Yang, {J. S.} and Ok, {S. H.} and Woo, {D. H.} and Byun, {Y. T.} and Jhon, {Y. M.} and T. Mizumoto and Lee, {W. Y.} and S. Lee",

year = "2006",

doi = "10.1117/12.648371",

language = "English",

isbn = "0819461652",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

booktitle = "Integrated Optics",

note = "Integrated Optics: Devices, Materials, and Technologies X ; Conference date: 23-01-2006 Through 25-01-2006",

}

Roh, JW, Yang, JS, Ok, SH, Woo, DH, Byun, YT, Jhon, YM, Mizumoto, T, Lee, WY & Lee, S 2006, Wafer bonding between InP and Ce:YIG(CeY₂Fe₅O ₁₂) using O₂ plasma surface activation for an integrated optical waveguide isolator. in Integrated Optics: Devices, Materials, and Technologies X., 612316, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6123, Integrated Optics: Devices, Materials, and Technologies X, San Jose, CA, United States, 23/01/06. https://doi.org/10.1117/12.648371

Wafer bonding between InP and Ce:YIG(CeY₂Fe₅O ₁₂) using O₂ plasma surface activation for an integrated optical waveguide isolator. / Roh, J. W.; Yang, J. S.; Ok, S. H. et al.
Integrated Optics: Devices, Materials, and Technologies X. 2006. 612316 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6123).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Ok, S. H.

AU - Woo, D. H.

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