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Wafer bonding between InP and Ce:YIG(CeY2Fe5O 12) using O2 plasma surface activation for an integrated optical waveguide isolator
J. W. Roh, J. S. Yang, S. H. Ok, D. H. Woo, Y. T. Byun, Y. M. Jhon, T. Mizumoto, W. Y. Lee, S. Lee
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1
Scopus
citations