TY - GEN
T1 - Wafer bump inspection with transparent film layer using vertical scanning interferometer for semiconductor packaging
AU - Kim, Min Young
PY - 2008
Y1 - 2008
N2 - With micro-miniaturization and high density integration of semiconductor packages, wafer bump and substrate bump need to be in-line inspected in terms of volume, area and height. A vertical scanning interferometer is proposed for their shape inspection in three dimensions. For wafer bump under transparent film layer, specially-designed information extraction algorithms are suggested, which are composed of top surface and under-layer profile detection algorithm based on interferogram acquired with variations of vertical inspection head position. A series of experiments is performed for verification of the proposed inspection system, and acquired test results are discussed in detail.
AB - With micro-miniaturization and high density integration of semiconductor packages, wafer bump and substrate bump need to be in-line inspected in terms of volume, area and height. A vertical scanning interferometer is proposed for their shape inspection in three dimensions. For wafer bump under transparent film layer, specially-designed information extraction algorithms are suggested, which are composed of top surface and under-layer profile detection algorithm based on interferogram acquired with variations of vertical inspection head position. A series of experiments is performed for verification of the proposed inspection system, and acquired test results are discussed in detail.
KW - 3D measurement
KW - Semiconductor inspection
KW - Vertical scanning interferometer
KW - Wafer bump inspection
UR - http://www.scopus.com/inward/record.url?scp=58149094503&partnerID=8YFLogxK
U2 - 10.1109/ICCAS.2008.4694694
DO - 10.1109/ICCAS.2008.4694694
M3 - Conference contribution
AN - SCOPUS:58149094503
SN - 9788995003893
T3 - 2008 International Conference on Control, Automation and Systems, ICCAS 2008
SP - 513
EP - 516
BT - 2008 International Conference on Control, Automation and Systems, ICCAS 2008
T2 - 2008 International Conference on Control, Automation and Systems, ICCAS 2008
Y2 - 14 October 2008 through 17 October 2008
ER -